I work at a nanotech lab where I do silicon wafer dicing. (The wafer saw cuts only parallel lines) We are, of course, trying to maximize the yield of the die we cut. All the of die will be equal size, either rectangular or square, and the die are all cut from a circular wafer. Essentially, I am trying to pack maximum rectangles into a circle.
I have only a pretty basic understanding of MATlab and an intermediate understanding of calculus. Is there any (relatively) simple way to do this, or am I way over my head?